The tinning paste Pastin 40 enables fast and clean tinning of surfaces made of copper, copper alloys or steel. Although Pastin 40 is relatively universally applicable, it should only be used in combination with lead-containing tin solders such as SnPb40, SnPb37 or Pb74Sn25Sb1 (body solder).
Before application, briefly stir or shake the paste again. Then, apply the paste to the area to be tinned with the brush. Afterward, carefully heat the paste with a flame until liquid PbSn40 drops and hydrochloric acid form on the surface, ideally preparing the surface locally for tinning. Quickly spread the PbSn40 drops with a lint-free cloth. The surface is then tinned. Only spread the tin once the paste has completely reacted. Afterward, you can immediately continue working with the appropriate solder. The acid produced during the reaction is corrosive and must be rinsed away promptly with water or mordant after the tinning/soldering process.
Surfaces that are prepared with pre-tinning pastes can be soldered or tinned very well and cleanly.
In the bodywork area, Pastin 803, which is optimized for lead-free solders and for SnCu3 copper pipe installation, should be used.
In the field of copper dish tinning and generally as a universal lead-free tinning paste, Pastin 100 is very well suited.
The Pastin 830 is ideally suited for soldering or tinning with tin-silver solders.
During processing, effective extraction/fresh air supply, e.g. also by ventilation, must be ensured due to the soldering fumes.
Pastin 40 is available in an attractive combination with triangular rods made of the solders SnPb40, SnPb37 and the body solder Pb74Sn25Sb1.
